2023 IEEE the 3rd International Conference on Intelligent Technology and Embedded Systems (ICITES)
October 27-30, 2023, Huzhou, China

2023年IEEE第三届智能技术与嵌入式系统国际会议 | 2023年10月27-30日 | 中国 湖州

2023 IEEE the 3rd International Conference on Intelligent Technology and Embedded Systems (ICITES) will be held in Huzhou, China during October 27-30, 2023. It is co-sponsored by IEEE CEDA Chengdu Section and IEEE EDS Chengdu Section, hosted by University of Electronic Science and Technology of China and Jiangsu Computer Society, supported by Nanjing University of Science and Technology, Zhejiang University, Dalian University of Technology, Research Institute Computer and Systems Aléatoires, George Mason University.

Intelligent technology-driven embedded systems, such as smart factories, autonomous vehicles, industrial robots, wearable devices, and intelligent Internet-of-Things, are fast-growing and will definitely have great impacts on human economy and society. To facilitate intelligent technologies (e.g., machine learning and deep learning particularly) implemented in resource-constrained embedded systems, it is of critical importance to improve the way to design, build, test and evaluate emerging intelligent processors, accelerators and related systems. Since most intelligent embedded systems are implemented in networked environment and have mission-critical requirements, it is crucial to ensure their dependability, safety, reliability, security, real-time and efficiency. 2023 3rd International Conference on Intelligent Technology and Embedded Systems (ICITES) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in intelligent embedded systems. The scope of conference will cover the design, implementation, optimization, verification, and validation of intelligent embedded systems in various fields, emphasizing on intelligent processors, AI accelerators, edge-computing systems, intelligent Internet-of-Things, cyber-physical systems, dependable AI, embedded security, and autonomous systems.

ICITES 2023是智能技术和嵌入式系统的第三届国际会议。会议日期:2023年10月27-30日。会议地点:湖州。
本次会议由电子科技大学、江苏省计算机学会计算机系统结构专委会、计算机应用专委会联合主办,并得到南京理工大学,浙江大学,大连理工大学,法国Research Institute Computer and Systems Aléatoires和美国乔治梅森大学等高校的支持。


Co-sponsored by
Hosted by

Conference Proceedings 会议论文集

Accepted and registered full papers of ICITES 2023 will be published by IEEE Conference Proceedings, including in IEEE Xplore, submitting for EI Compendex and Scopus index after conference. Authors are required to attend the conference and share a report based on the paper.

会议录用并参会报告的论文将由IEEE会议论文集出版, 收录至IEEE Xplore,并于会后提交EI核心和Scopus等主流检索。

ICITES 2023 已进入IEEE官方列表会议:https://conferences.ieee.org/conferences_events/conferences/conferencedetails/59818

ICITES 2022 proceedings archived by IEEE Xplore, EI Compendex, Scopus.
ICITES 2021 proceedings archived by IEEE Xplore, EI Compendex, Scopus.
Submission (投稿链接): https://easychair.org/conferences/?conf=icites20230 | Manuscript Formatting and Templates (文章模板下载)

SCI / EI / Scopus Journals 会议特刊

Selected papers after extension will be recommended to the following journals:

Journal of Electronic Science and Technology
ISSN: 1674-862X
Citescore Track: 2.7
Indexing: Ei Compendex, Scopus, INSPEC, CSCD, DOAJ etc.,
OA on ScienceDirect.
Journal of Systems Architecture
ISSN: 1383-7621
Citescore Track: 7.3; Impact Factor: 5.836
Indexing: SCIE, Ei, Scopus, etc.
Journal of Circuits, Systems and Computers
ISSN: 0218-1266
Citescore Track: 2.6; Impact Factor: 1.278
Indexing: SCIE, Compendex, Scopus, etc.
Computer Systems Science and Engineering
ISSN: 0267-6192
Citescore Track: 1.9; Impact Factor: 4.397
Indexing: SCI, Scopus, ACM Digital Library


October 27-30, 2023, Huzhou, China

Important Dates

Submission Deadline: August 20th, 2023
Notification: September 20th, 2023
Registration Deadline: October 05th, 2023

Contact Us

  • Email: icites@163.com
  • Mon to Fri: 10.00am to 6.00pm

Cheng Zhuo

Zhejiang University

Fanxin Kong

Syracuse University, USA

Kun Cao

Jinan University, China

Cheng Dai

Sichuan University, China

Liying Li

Nanjing Univ. of Science and Technology